PCB proofing etching process considerations

Subsidiary Classification: Industry Information

2023-12-21 15:03

Uniformity of lines
PCB proofing circuit board generally need to go through the etching operation. For example, the whole plate copper plating process needs to etch away the parts other than the photosensitive film, but the uniformity of the lines must be maintained during the etching operation. At the same time, copper must be plated twice on all parts of the plate surface, and the periphery of the panel needs to be etched away at the same time, so as to maintain the uniformity and reliability of the lines and the panel.
Suitable corrosives
The vast majority of PCB multilayer circuit boards in the corrosion operation, are based on sulfate-based etching solution, in which copper is separated by electrolysis. In the etching process of PCB multilayer circuit board, the copper in it is generally separated by electrolysis, and only suitable corrosives can be reused. Therefore, the appropriate corrosives must be selected for etching operations.
corrosion rate
The etching process of PCB multilayer circuit board also needs to reasonably control the corrosion rate of the etchant. The commonly used etchant in the market today is water/ammonia chloride etching solution, and a reasonable corrosion rate is required when in use, because too fast corrosion rate may cause corrosion on the board surface of the PCB board, and too slow corrosion rate may lead to poor corrosion effect on the board surface.